Beryllium Copper 25 Alloy

Beryllium Copper 25 is a Copper base alloy with the capability of being strengthened by precipitation heat treatment. The alloy furnishes the best combination of electrical conductivity, corrosion resistance and mechanical strength necessary for numerous electronic and electromechanical devices. The alloy is quite satisfactory for fabrication with good formability and joining characteristics. Forming is readily accomplished from the annealed temper. Severe bending will be less successful from hard or heat treated tempers and requires large fold radius ratios. Beryllium Copper 25 is able to be soldered, brazed, and welded by most standard techniques. The brazing temperature must be kept under 1450º F and cycle time minimized to avoid loss of heat treated strength. Heat treating should be performed subsequent to welding to obtain uniform high strength. The alloy is not susceptible to an increase in magnetic attraction from plastic deformation during service