FUKANGXIANG GROUP(HONGKONG)CO.,LTD
Base Material: FR-4,Aluminium-backed board,Halogen-free,Lead-free compatible,High Tg,High CTI,CEM-1,CEM-3 etc. Max Dimension: 630x530mm Copper thickness of inner layer: 18-140um Copper thickness of outer layer: 12-210um Min.Annular ring:0.10mm Min.solder mask clearance:0.05mm Min.solder mask clearance: 0.045mm Impedance tolerance: ±10% Finished board thickness: 0.25mm-3.5mm Outline precision: ±0.1mm Layers No. :2-12layers Inner layer circuit: 4/4mil Out layer circuit width/spacing: 4/4mil Board Thickness: 0.1-1.6mm Min.drill bit size: 0.2mm Aspect ratio: 8:01 Surface Finished type :HASL,Flash golds,ENIG,OSP(lead freecompatible),Carbon ink,Peelable S/M,HASL(lead free),Immersion silver/tin,Gold finger plating,ENIG+gold finger plating,Immersion Silver+gold finger plating
Shenzhen - CHINA Map
Other products and services for this supplier
- Printed circuits
- printed circuits
- pcb
Sites
Shenzhen,guangdong Provice 518102 Shenzhen China
CHINA
work Tel: +86 75529666191
faxFax: +86 75529666195 Send an email
