INSETO (UK) LIMITED

DELO-PHOTOBOND UV cured and light curing adhesive are one-part adhesives that cure at room temperature, with visible light (400-550nm) or UV light (320-400nm). Featuring a UV curable acrylate base, they are stress equalising and highly flexible, with up to 300% elongation at tear. They are ideal for UV glass bonding or sealing applications, as they are fast curing and optically clear once cured (product dependant). Other typical applications include bonding, sealing and coating of plastic and metals. Curing through translucent plastics and deep layers is also possible with DELO-PHOTOBOND, since visible light is not filtered like UVA. Full cure is achieved in seconds. Viscosities range from 100 to 30,000mPa.s. Some materials have USP VI approval, for use on medical devices. ** Click for more **

DELO-KATIOBOND UV curing (320-400nm) and light activated (400-550nm) epoxy adhesives are one part solvent free epoxies suitable for bonding, sealing and potting applications. DELO-KATIOBOND light activated adhesives can be used in opaque applications, as once the adhesive has been initiated via visible light, curing starts due to the decomposition of the photo-initiator and continues to completion. The curing is by cationic polymerisation, hence the product name Katiobond. Information on UV Curing Lamps can be found here. The range has good temperature resistance, up to 180 degrees C and excellent chemical resistance, making them ideal for automotive and harsh environment use. The epoxies are dry to touch after cure (no oxygen inhibition occurs). Cured products exhibit low shrinkage, resulting in low stress on delicate devices. Low water absorption and very low ionic content make them ideal for electronic applications. ** Click for more **

DELO-DUALBOND adhesives are one part solvent-free adhesives suitable for bonding, sealing and potting applications. They have good resistance to thermal shock, and some products are optically clear for large-area bonding, especially suitable for display assembly. They use a combination of light (UV or VIS) and either heat or humidity to achieve full cure. They are used in applications that require a very quick initial handling strength, with full cure being achieved off-line or in a subsequent process where cycle time is not so critical (e.g. in-line reflow ovens). Existing applications include electronic assembly, compact camera modules, RFID and smart labels, and general applications requiring short cycle times. ** Click for more **

DELOMONOPOX epoxies are one part, heat cured epoxy resin adhesives for bonding, casting and sealing of joints. The epoxy resin adhesives are high strength materials that can be used as alternatives to riveting, welding and brazing in high stress applications. Epoxies exhibit excellent adhesion to metals, ferrites and ceramics. Special advantages of epoxies include their resistance to temperature, chemicals and low water absorption. They will also protect against corrosion. The epoxy resin is supplied ready to use with no mixing required. Curing occurs in 15-75 minutes @ 130-180 degrees C. Versions are available with good flow properties or with high run-off resistance. ** Click for more **