Low Temperature Co-fired Ceramic (LTCC)
Advanced packaging technology for electronic modules
Description
LTCC (Low Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave performance characteristics. Thanks to its low sintering temperature (around 900°C) allows it to co-fire with highly conductive metals such as silver and gold. It is sometimes referred to as “glass ceramics” because glass is mixed in its main raw material, alumina. Elite Advanced Technologies is one of the few LTCC specialists globally that is producing its own green tape (base material low temperature co-fired ceramics). LTCC is best suited for applications that can take advantage of one or more of the following: Good electrical performance Dimensional and electrical stability under temperature, moisture and mechanical stress 3D capability curved, cavities, channels Effective thermal management with metal loaded vias (>100 W/MK) Hermeticity Matched TCE with semiconductors (Thermal Coefficient of Expansion) Multiple assembly and packaging solutions
Product characteristics
- Category
- Thickfilm Thickfilm, LTCC
- Conductor material
- Ag/PdAg Ag/PdAg
- OG (Glass coating)
- Transparent / Black Transparent / Black
- Max # Layers
- 10 10
- Substrate Color
- Grey White, Black
- Panel Size
- 110mmx110mm 120mmx120mm standard (180mmx180mm possible)
- Panel size tolerance
- ±50um ±50um
- Thickness per layer
- 0.25, 0.36 or 0.5mm 0.1, 0.25, 0.38, 0.5, 0.635, 0.8 or 1.0mm
- Thickness tolerance
- ±5％ ±5％
- Warpage (non-flatness)
- ≦±0.2％ ≦±0.2％
- Warpage
- ≦0.3 %
- Thermal
- ppm/°C Coefficient of Thermal Expansion (CTE)
- Thermal Conductivity
- ≒3 W/MK
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