Slicing into wafers
Description
After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.
- Cutting - steels and metals
- Wafer
- Wafers Slice
- Slice Wafers
Similar products from OPSIL LTD
OPSIL LTD
Bulgaria
Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25
OPSIL LTD
Bulgaria
The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.
