PCB Packaging Metrology System  - ZYGO CORPORATION


The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. Coherence Scanning Interferometry (CSI) is the measurement technology at the core of the APM650 system. This non-contact technique provides high-precision, and high-value surface metrology benefits including: • Measures virtually all types of surfaces, from rough to super smooth, including thin films, steep slopes, and large steps. • Sub-nanometer measurement precision is independent of field magnification • Gage capable performance - exceptional precision and repeatability for the most demanding production applications. • SureScan™ vibration tolerance technology - robust operation in virtually any environment.

Precision measuring instruments
  • PCB inspection
  • precision surface metrology
  • non-contact PCB measurement
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