COSMOS-RAY MACHINERY ELECTRONICS CO., LIMITED

Made in China, Cosmos-Ray Machinery Electronic Equipment Factory(http://www.cr888.com, E-mail:MHZ@vip.163.com), Product:High frequency pre-heater, High frequency plastic welding machine, High frequency simultaneous weld &cutting machine, Toothbrush blister packing machine, Auto blister packing machine, More positions automatic circular tray type plastic welding machine.

RF Preheater, Made in China,Cosmos-ray Machinery Electronic Equipment Factory,E-mail:MHZ@vip.163.com, RF Preheater USES: Preheating of thermosetting plastics for compression molding.（APPLICATIONS: Preheating epoxy, Melamine,urea, silicone and phenolic resins）.http://www.cr888.com/e_cr_2_10.htm

◆The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc.

RF Preheater (Roller Electrode type), Made in China,http://www.CR888.com,E-mail:MHZ@vip.163.com, This type uses special rotating electrode, achieving highly efficient heating.Less risks of damaging wires in the IC and Semiconductor packaging operation.

◆The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc.

◆The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc. ◆◆The H.F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of IC, commutator, transistors and other micro-electronic components. The device can be used to improve the surface glossiness of products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic components and semi-conductor IC, so as to improve the grade and performance for the products.

Thermoset Plastic Preheating. ◆The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc. ◆◆The H.F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of IC, commutator, transistors and other micro-electronic components. The device can be used to improve the surface glossiness of products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic components and semi-conductor IC, so as to improve the grade and performance for the products.

The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound, bakelite and urea formaldehyde molding powder, etc., including preformed project such as compressed molding, transfer molding and extrusion molding, etc. The H.F. Preheating process is widely applied for Thermo-set plastic molding such as for electric components, mechanical parts, bakelite products, urea formaldehyde plastics products, melamine tablewares, and packaging of IC, commutator, transistors and other micro-electronic components. The device can be used to improve the surface glossiness of products, prevent water-like wrinkle and strengthen the fluidness of powder resin. It can pre-heat and soften the powder resin (caking) prior to the plastic packaging for the electronic components and semi-conductor IC, so as to improve the grade and performance for the products.