In a development that could have a significant impact on the electronics industry, the latest ceramic metallized insulators are making strides in enhancing semiconductor packaging and related applications. These insulators offer a range of practical benefits that can improve the performance and durability of electronic components. Let’s take a closer look at what sets them apart: Key Features of Ceramic Metallized Insulators: 1. Stability and Strength: The ceramic material employed in these insulators boasts an even texture, ensuring every batch maintains stable quality and flexural strength. This consistency in material quality is pivotal for the reliability of electronic components. 2.Dense and Weldable Metal Layer: The metal layers in these insulators are densely applied, providing a smooth and even surface. This not only enhances their appearance but also makes them easy to work with, particularly in manufacturing processes.
China
Innovacera supplies precision metallized ceramic components in aluminum oxide ceramics for the military, medical, and aerospace industries. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallized on flat, cylindrical, and complex ceramic bodies. Moly-Manganese is the typical base coat materials used for metallization.
Request for a quoteChina
Metallized Ceramic Componenets: Innovacera supplies precision metallized ceramic ring in aluminum oxide ceramics for the military,medical, and aerospace industries. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallized on flat, cylindrical, and complex ceramic bodies. Moly-Manganese is the typical base coat materials used for metallization.In order to achieve the welding between ceramic and metal, the ceramic surface firmly adheres to a layer of the metal film, which is ceramic metallization. Refractory-metalized aluminum oxide ceramics widely use in power grid tubes, vacuum interrupters, and similar applications where metal to ceramic joints of exceptional strength and hermeticity is required.
Request for a quoteChina
DBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin)
Request for a quoteChina
High Hermeticity Metallized Ceramic Bushing /Innovacera Features: 1.Material: 96% Aluminia(AL2O3) 2.Coating Layer:Molybdenum-Mananese(Mo/Mn) 3.These metallized ceramics are ideal for high voltage, high vacuum and high pressure applicationos. So far the most widely-used and effective method for creating a leak-tight, robust joint between ceramic and metal is by brazing . A thin layer of metal deposited on a ceramic part enables brazing between ceramic and metal part that h as a different coefficient of thermal expansion. A layer of Molybdenum-Manganese is deposited with a typical thickness of 8 to 30 µm after sintering. The metallized surface receives a secondary coating of nickel to seal and improve wettability for later brazing.
Request for a quote