AHN's comprehensive Benchtop Equipment range includes a variety of centrifuges, such as small benchtop, universal, clinical, hematocrit, and refrigerated options, multiple vortex mixer options, rollers and rotators, and magnetic stirrers with and without heating. This range offers impressive user-friendly and safety features, making it easy and safe to use. Every instrument is extremely robust, designed for extended runs, and operates quietly. They also have a small footprint, taking up minimal benchtop space. Safety features include an electronic safety brake system to prevent the lid from opening during operation and suction pads for stable operation. The instruments are equipped with brushless DC motors that require no maintenance, making them ideal for extended runs. The equipment is designed with the user experience in focus, featuring large displays and intuitive interfaces for increased comfort. The equipment comes with a two-year warranty.
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Dymax Ultra LightWeld® 9501F is a UV/Visible lightcuring adhesive optimized for electric vehicle battery potting and bonding. Features: - Cure using UV/Visible light or LED - 385 nm LED Curing - Blue Fluorescing technology for bond line inspection - One part formulation – no mixing - Solvent free Excellent adhesion to metals & plastics
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Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible
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Highperformance conformal coating with secondary moisture cure for shadow areas. Features: - Cures with UV/Visible light - DualCure secondary moisture cure for shadow areas - Fluoresces blue under black lights - Excellent thermal shock resistance - High temperature flexibility - Excellent chemical and corrosion resistance - Good temperature/humidity (85/85) performance - One part formulation no mixing - Solvent free - Fast tackfree cure - Halogen free - MILI46058C Approved
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Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]
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