AMETEK EMC can provide packaging solutions for every need, with capabilities for applications such as: sealed pouches, anti-static bags, custom boxes, multi-material packaging, shock and vibration sensitive packaging, target component protection, and packaging for sterilization.
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TSE’s design team creates custom connectors incorporating: component design and material selection, design for manufacturing (DFM) technique.
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The ablation of fine wires by laser technology is a precise technique that involves the controlled removal of material from conductive wires, enabling numerous applications across various industries.
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An in-house dedicated testing lab offers electrical, mechanical, and environmental test services to help customers characterize, verify, and validate requirements of components and assemblies.
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Automated control and manipulation of fine wire as small as 50AWG allows for twisting, cabling, reel-to-reel laser processing, and precisely ablated discreet lengths for applications that range from subcutaneous biometric sensors to implanted pacing leads and high-density wire harnesses for imaging catheters. High-density wire harness assembly is vertically integrated made possible through a combination of fine wire cabling and the dressing and termination of high-count cable to tight pitched circuitry.
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