Description

The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections and planed surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations. With the Leica EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.

Milling - steels and metals
  • ion beam miller

Additional product literature

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Leica EM TIC 3X - Triple Ion-beam cutter

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