FlexTC benchtop temperature forcing system for IC test

From -55⁰C to +155⁰C with Cooling power 11W@-45⁰C


FlexTC Thermal Forcing System stimulates DUT to the desired temperature by direct contact/conduction between a thermal head’s plunger and the DUT. Soldered down or socketed DUT’s are accessed through a selection of interfaces such as adapter plates, boom stands, vacuum and pneumatic systems. . Powerful stand-alone Thermal control unit, Features: o Greatest cooling power 21W@-40⁰C o Extended temperature range enable to reach easily -40⁰C or less at Tj o Fastest time to temperature ratio o Very short stabilize soak time o Excellent temp. stability 0.2⁰C o Operated by a smart controller which is accessed through a 7” color touch-screen with extensive menu o Can be remotely controlled via an Ethernet Flex TC System suits your device test at: o Your test bench o ATE in your lab. & can be seamlessly integrated in production with handlers and ATE’s o MaxTC can also be used to test multi-site DUT’s o Also as a thermal chuck with probe station

Testing equipment
  • Device testing
  • Semiconductors
  • temperature probes
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