GIP TECHNOLOGY CORPORATION

GIP Technology pulsed fiber laser module (FLM) is a wavelength of 1064nm, high pulse energy laser sources. Its energy per pulses up to 1mJ is available with excellent beam quality. The pulsed FLM not need water-cooling or replacement parts and requires only a 24V DC power source to provide amplification for the low power signal. It can be used in the precision marking, LIDAR, micro cutting, 3D scanning, Non-linear optics as well as research and development (R&D) environments. The compact, robust, and reliable package design are flexible and easy to be integrated with any complicated system. The wide operating temperature can work in the harsh environment. Via the friendly user-interface, the customer can quickly access and set all FLM data.

GIP Technology 532nm Fiber Laser unit for Industrial applications, are designed to provide a combination of high power of 5W, high stability, and ideal beam quality. The fiber lasers are widely used for fiber sensor, medical, nonlinear optics research, and measurement applications.

GIP Technology pulsed fiber laser module (FLM) is a wavelength of 1550nm, high pulse energy laser sources. Its energy and peak power per pulses up to 75uJ, and 25kW are available with excellent beam quality. The pulse FLM can reduce the ASE under low repetition rate operation by modulation pump function. The pulsed FLM not need water-cooling or replacement parts and requires only a 24V DC power source to provide amplification for the low power signal. It can be used in the LIDAR, 3D scanning, Non-linear optics as well as research and development (R&D) environments. The compact, robust, and reliable package design are flexible and easy to be integrated with any complicated system. The wide operating temperature can work in the harsh environment. Via the friendly user-interface, the customer can quickly access and set all FLM data.

GIP Technology P-series Ytterbium Doped Fiber Amplifiers (YDFAs) are designed for use in the high-power applications. These series incorporate a special, unique, and flexible structure to product maximum signal gain and saturated output power. The bench-top package size serves the area size, can be used in the components or sub-assembly manufacturing as well as research and development (R&D) environments. In addition, these units also provide a user-friendly status monitoring via an LCD display, LED indicators, and various communication interfaces (RS232)