Technical information When machining bar material particular care should be taken that as little material as possible is removed as cutting forces should be minimised and costs reduced. Therefore the exchangeable disc should be selected as a function of the work-piece which is to be parted. Tool systems Das RC-System und S-System sollte als erste Wahl bei den Abstechbearbeitungen verwendet werden. Die Schneidplatten wurden so gestaltet, damit der Span schmäler als die abzustechende Nut ist und ein optimaler Spanablauf gewährleistet werden kann. Das Z-CUT-DUO System ist bedingt durch die Doppelschneidplatte auf eine bestimmte Stechtiefe begrenzt.
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Different knives can be manufactured to fit your products and your machine.
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The new EWS tcJet range Optimal chip transport thanks to EWS tcJet EWS tcJet transports the coolant through the inset directly to the cutter and guarantees optimal chip transport... At the same time, the cutting edges have a significantly longer service life. EWS's interior cooling version is available for normal and high-pressure applications for various tool holder fixtures and cutting insert manufacturers.
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Sapphire (Al2O3) is one of the hardest minerals and optical materials available for use in the range from UV up to 5µm. Sapphire is birefringent and if its use is for critical optical application then the crystal might have to be cut along the zero degree plane, or C-Cut. Random cut is usually cut along a plane that is 60° off-axis as the growth in this direction is the easiest to grow. Random cut is anything that is not the C-Cut angle. Sapphire can fluoresce depending upon the concentration of other minerals within the lattice, for example Iron (Fe) or Chromium (Cr). Clear Sapphire might fluoresce orange when illuminated by UV light if impurities are in the crystal. Fluorescent free Sapphire has to be grown from 'pure' feedstock and seed and in an environment that cannot place impurities into the lattice. READ MORE ... CLICK LINK
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Diacut cutting discs in diamond and CBN are characterised by a high cutting ability and efficiency in the cutting process.
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