The xiD series is based on the most advanced Sony CCD sensor (available till 2025). As CCDs, they boast high sensitivity and 14 bit dynamic range. The cameras have excellent passive cooling properties, great performance and allow USB bus powering. The board-level versions include a system integration guide for designing an optimal heatsink and enclosure. Due to the implementation of a 4 tap readout, this series supports the maximum frame rates that the sensors deliver.
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High resolution direct phosphor imaging where sensor is bonded to a fiber-optic plate, which is then coated with a phosphor scintillator. The field of view of the scintillator is 36x24 mm, ideal for researching the elemental composition and structure of biological samples through: Micro CT (Computed Tomography), Soft X-Ray Microscopy, Crystallography, X-Ray Spectroscopy, Coherent X-Ray Diffraction, Non-Destructive Testing, Fluoroscopy, Plasma Diagnostics, Radiography, Industrial CT scanning and more.
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The xiQ and xiC camera series are highly versatile with a wide range of modern global shutter CMOS sensors. The ultra-compact form factor, barely larger than the C-mount, combined with Micro-B, Type-C, and flex ribbon connectors make these cameras the perfect fit for various applications, especially for automation and embedded vision systems. Reaching a resolution of 4.1 Mpix (2,048 x 2,048 pixels) and up to 90 fps pixels.
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The xiC camera series is highly versatile with a wide range of modern global shutter CMOS sensors. The ultra-compact form factor, barely larger than the C-mount, combined with Micro-B, Type-C, and flex ribbon connectors make these cameras the perfect fit for various applications, especially for automation and embedded vision systems. Reaching a resolution of 24.5 Mpix (5,320 x 4,600 pixels) and up to 15 fps pixels.
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The xiQ offers multiple choices for sensors, boards and connectors. Being extremely small and robust make this camera ideal for machine vision. Specifically, the board-level units are preferred choice for system integrators due to the single board design. These enable the customers to optimize their devices in size, compactness, and footprint. The low heat dissipation and low power consumption are complimentary advantages.
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