Modular Waferhandling-System

Description

The modular Waferhandling-System facilitates all possible handling processes of wafers. Loading and unloading, conveying, gripping, inspecting, sorting and singulating can be realized in one system. Our Ultrasonic Suspension Technology keeps the wafer on distance the whole time and therefore prevents micro-scratches and contamination. Features of the Modular Waferhandling-System: - Modular Design - Contactless transport - Customizable according to customer specifcations - Linking various processes in one system

Handling - Machines & Equipment
  • wafer handling
  • wafer handling system
  • contactless wafer handling

Additional product literature

Videos

Contactless Wafer Handling ZS-Handling

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