Using the laser module Nd YAG Dynamic LASEST, it is possible to carry out more than 20 procedures for various directions in the field of aesthetic medicine and cosmetology. A large number of handpieces are used for this module, in which the latest latest technologies are implemented, such as Flat Spot, Gauss Beam, 3d Pixel. Highenergy laser radiation with a wavelength of 1064 nm, realized in unique time modes (from ultrashort to ultralong pulses) provides a selective effect on deep targets without thermal damage to the skin. For maximum comfort and convenience of the procedure, LASEST users can use the contactless system of dynamic skin cooling CoolFlash. When working with LASEST laser modules, you can control the temperature and flow rate of cold air in the treatment area, which guarantees an excellent result during the procedure.
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Dymax Ultra LightWeld® 9501F is a UV/Visible lightcuring adhesive optimized for electric vehicle battery potting and bonding. Features: - Cure using UV/Visible light or LED - 385 nm LED Curing - Blue Fluorescing technology for bond line inspection - One part formulation – no mixing - Solvent free Excellent adhesion to metals & plastics
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Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible
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Highperformance conformal coating with secondary moisture cure for shadow areas. Features: - Cures with UV/Visible light - DualCure secondary moisture cure for shadow areas - Fluoresces blue under black lights - Excellent thermal shock resistance - High temperature flexibility - Excellent chemical and corrosion resistance - Good temperature/humidity (85/85) performance - One part formulation no mixing - Solvent free - Fast tackfree cure - Halogen free - MILI46058C Approved
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Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]
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