From sputtering targets to materials used for thermal/e-beam evaporation, Angstrom Sciences has the ability to suggest and direct the most suitable materials for any application. We draw from variety of specialized processing techniques such as Hot Pressing, Cold Pressing, Hot Isostatic Pressing (HIP), Cold Isostatic Pressing (CIP), Vacuum Induction Melting (VIM) and Vacuum Arc Casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards. We routinely provide backing plates (copper, molybdenum, copper-chromium) for planar, circular and cylindrical sputtering targets, conductive pastes and thermal transfer foil for sputter target cooling, and also offer bonding services as part of our comprehensive range of services to the PVD community.

Thin coating for integrated circuits

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