Description

APM650™ Packaging Metrology System APM650 metrology system, for inspection of panel-based PCBs and other advanced semiconductor packaging applications. Trace - width, height, space, roughness Via Hole - depth, top and bottom diameter, roughness Via Recess - depth and height Alignment Mark - offset DX, DY, TP SRO Pad - depth, top and bottom diameter Surface Roughness - Ra for all surfaces Solder Bump - width, height, coplanarity, spacing The APM650™ packaging metrology system is a new inspection tool for automated measurement of panel-based PCBs and other advanced packaging applications. It provides 2D & 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. Powerful Performance Coherence Scanning Interferometry (CSI) is the measurement technology at the core of the APM650 system. This non-contact technique provides high-precision, and high-value surface metrology benefits including: • Measures virtually...

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