The IST AG PW RTD sensor has been developed as an alternative to the traditional wire-wound sensors. The PW sensor combines the advantages of high accuracy and precision of the wire-wound sensors with the advantages of thin-film sensors that offer robustness, small dimensions and very low hysteresis at an optimal price level. Compared to a standard thin-film sensor measuring up to +300 °C in IEC 60751 F0.15 (IST AG reference class A), the IST AG PW sensor measures with high accuracy up to IEC 60751 F0.15 (IST AG reference class A) within a wide operating temperature range from -200 °C to +600 °C. Due to the special construction and stable characteristics curve, the IST AG PW sensor is also suitable for low temperature applications. As an additional feature, the PW sensor is available in round ceramic housing with the same dimensions as a traditional wire wound sensor, meaning easy interchangeability into existing temperature applications.
Switzerland
IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.
Request for a quoteSwitzerland
IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.
Request for a quoteSwitzerland
Bondable platinum 1000 Ohm RTD component Nominal resistance 1000 Ω at 0 °C Operating temperature range —50 °C to +150 °C TCR Pt 3850 ppm/K Chip size/dimensions 0.75 x 0.75 x 0.3 mm Tolerance/class IEC 60751 F0.3 (IST AG tolerance class B) Connection type Bondable pads (Au) Packaging Chip tray, sensor-side up
Request for a quoteSwitzerland
IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.
Request for a quote