Production Technological Parameters

  • Electric and electronic components - machines for manufacturing
  • Technological Parameters

Product characteristics

Maximum customer format – double sided PCBs
560 X 360 mm
Maximum customer format – single sided PCBs
570 x 370 mm
Minimum distance between conductor and board edge
0.5 mm
Minimum distance between tracks
0.15 mm
Minimum track width
0.15 mm
Minimum annular ring width (radius)
0.2 mm
Minimum diameter of plated hole
0.3 mm
Minimum diameter of unplated hole
0.4 mm
Permissible offset between copper layer and drilling
0.15 mm
Permissible offset between solder resist and copper layer
0.1 mm
Permissible offset between legend and drilling
0.3 mm
Permissible offset peelable mask and drilling
0.3 mm
Permissible offset carbon paste and drilling
0.3 mm
Scoring line width (laminate thickness 1,55 mm)
<= 0.6 mm
Scoring line relative position to nominal position shift
±0.2 mm
Upper and lower scoring line shift
±0.1 mm
Routed dimensions tolerances
±0.20 mm
Minimum distance between routing and conductor
0.30 mm
Solder resist thickness on copper
from 8 to 45 µm
HASL tin thickness
from 1 to 40 µm
ENIG gold and nickel thickness
Au from 0.05 to 0.125 μm Ni from 3.0 to 10 μm

Domain icon Manufacturer/ Producer

42-600 Tarnowskie Góry - Poland