Description

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Surface with solder stop mask Hole spacing 2.00 x 2.00 mm 44 x 42 soldering pads 1.60 x 1.60 mm Hole diameter 1.00 mm Working temperature max. 150 °C Soldering bath proof: 260 °C > 50 sec. Size 90.17 x 95.89 mm

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