Description

Fibre-glass CEM3 1.50 mm Single-sided 35 µm Cu Hot air leveling (HAL-leadfree) Hole spacing 2.54 x 2.54 mm 38 x 61 soldering pads 2.20 mm Ø Hole diameter 1.00 mm Size 100 x 160 mm

Additional product literature

PDF documents

Need more information from the seller?

Share on: