Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Pitches from 0.50 to 1.27 mm Hole diameter 1.00 mm Adaption board for 23 different SMD-IC's Prescratched rated break point for the separation of individual modules from the board Manual soldering: as for the SMD individual processing in the laboratory area, a freehanded coating of 100 to 200 single spots with precise metering hoppers is possible with grids from 0.50 to 1.27 mm Reflow soldering by means of purpose made separate SMD templates Size 120 x 175 mm
Germany
Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu - Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 20 (1.27 mm) Hole diameter 1.00 mm Size 22.86 x 22.94 mm
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Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 18 (1.27 mm) Hole diameter 1.00 mm Size 22.80 x 22.94 mm
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Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm CU Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 28, 44 (1.27 mm) and QFP 44 (0.80 mm) Hole diameter 1.00 mm Size 38.10 x 40.64 mm
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Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm) Hole diameter 1.00 mm Size 45.72 x 45.80 mm
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