Description

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au with solder stop mask Pitch 0.40 mm (15.7mil) and 0.50 mm (19.7 mil.) Adaption board for 23 different SMD-QFP s Hole diameter 1.00 mm Prescratched rated break point for the separation of individual modules from the board Gerber data for manufacture of the solder resist masks and the soldering paste imprint will be provided free of charge on request Size 132 x 203 mm

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