Description

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 6 x 1812 Chip Kond. 2 x 2220 Chip Kond. 1 x 2308 Melf 2 x 1206 Mini Melf 6 x Suitable for Pick & Place PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip...

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