RE711001-LF

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Hot Air Leveling (HAL lead free) Solder practice board for 11 different SMD components: 6x SO8 8x SO14 4x SO16w 4x SOT223-3 4x SO20 4x SOT89 22x SOT23 78x 1206 66x 0805 26x 1812 20x 2220 Size: 72.00 x 213.00 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for machine assembly (Pick & Place) of Fine-Pitch QFP 256 QFP 256 4 x Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for solder practices for SMD Fine-Pitch QFP 208 QFP 208 4 x For manual soldering and very suitable for machine assembly (Pick & Place) Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm CU Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 85 solder practices for SMD standard, fine pitch, and discrete components: version quantity PLCC 52, 68, 20 QFP 44, 84, 132, 184 sq. SOT23 3 x SOT89 2 x SOT143 1 x SOT233 1 x SO14 1 x SOM16 1 x SOL20 1 x Poti. 1 x DPAK 1 x Al. Kond. 6.30 mm 1 x Al. Kond. 4.00 mm 1 x Melf 2308 2 x Mini Melf 1206 6 x Tantal Chip Kond. A 1 Tantal Chip Kond. B 1 Tantal Chip Kond. C 1 Tantal Chip Kond. D 1 0402 Chip Kond. 10 x 0603 Chip Kond. 10 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 7 x 2220 Chip Kond. 1 x 1812 Chip Kond 2 x TSOP32 1 x 5020 Schwingquarz 1 x Also very suitable for machine assembly (Pick and Place) Size 100 x 140 mm