Linear Transfer Systems
Our OEM products - exclusively to meet your needs!
PowerSeal - Chip Module Encapsulation Machine
WCE2000 - Automatic Production System
Pearl ID - Centralised Card Personalisation
BT110-4 - Bending Test System
LP2100 - Centralised Passport Personalisation
BT310-3 - Bending Test System
For optimum process times with short cycle times.
Space-saving rotary transfer systems for high quantity demands.
Optimised interaction between man and machine.
2D Wire embedding technology
Quality assurance from a single source.
Automatic chip module encapsulation with unbeaten quality and highest throughput
The most affordable, flexible high-speed testing machine for chip modules
Cost-efficient and reliable glue tape lamination of chip module tapes
Flexible platform for antenna embedding and RFID inlay production
Very economical solution for antenna embedding and RFID inlay production