Sawing of wafers from glass and semi-precious stones
Description
The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.
- Cutting - steels and metals
- Saw Wafer
- Wafer Glass
- Glass Saw
Product characteristics
- Wafer thickness
- 0,05mm – 50mm
- Diagonal
- 140мм
- Diameter
- 150мм
- Slice thickness (losses)
- 0,04mm
Similar products from OPSIL LTD
OPSIL LTD
Bulgaria
Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25
