Short and ultra-short pulse laser processing of materials

Description

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

  • Laser - cutting and welding machines
  • Laser processing
  • Laser drilling
  • Laser Finde Cutting

Domain icon Manufacturer/ Producer

09126 Chemnitz - Germany

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