Thin Film Measurement Precise, reliable, characterization of thin film topography and thickness, and substrate topography Thin transparent thin films are critical across a variety of markets and applications, including consumer electronics, semiconductors and optics. Precise monitoring and control of thin film processes is achieved by measuring top surface, thickness, and substrate surface characteristics – all of which are enabled by multiple thin film measurement and analysis technologies available on ZYGO's 3D optical profilers. Advanced Model Based Analysis (MBA) is the most advanced CSI-based thin film measurement technique available from ZYGO, and works by comparing a theoretical model of the sample film stack to an actual measurement signal as seen by the profiler. This patented technology simultaneously measures topography, thickness, and substrate topography for single layer films from 50 – 2000 nm in seconds. In addition to thin film characterization, MBA technology...

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