Turn Key Wafer Production Line..
Bulgaria
After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.
Request for a quoteSlovakia
1 pallet 150 x 6 x 150g - 900pcs - Possible forecast on all of our products - Eur Pallets / CHEP Pallets or Hand Loading - Stickering in any language & Repacking at extra cost - Worldwide delivery For a detailed quote, please get in touch with our team of specialist - info@arufel.com We look forward to hear from you!
Request for a quoteFrance
Knives and blades for food processing fish, meat, chicken, vegetables and fruits
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