Description

Highest resolution advanced 2D and 3D X-ray system for fully automated analysis of the smallest features Semiconductor manufacturing requires automated, high-quality, reliable, fast and non-destructive inspection and analysis for optimum production as flaws can be found on the wafer, on a substrate, in a strip in the sub-assembly or in the final device. The new YXLON FF70 CL X-ray inspection system has been specifically developed to enable the very best automated analysis of the smallest and most demanding features within these samples. The result: impressively precise and reproducible test and inspection excellence.

Electronic components

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