Heat sink - Import export

We offer a Very Wide Range of Brands, please send me enquiry via liamm@merefields.com or enquires@merefields.com 

Inspired by customer inquiries, SEPA EUROPE has developed a new, modular assembly for the efficient cooling of chips. The core component is a SEPA axial fan that is mounted on a 40 mm pure aluminium heat sink – a so-called Kühligel®. It is equipped with a finger guard and a double-sided adhesive heat pad for screwless mounting on the housing or inside the device. Thanks to the compact design, the light weight and the screwless mounting, this assembly enables accurate positioning and thus effective cooling of the hot spot. The chip cooler HXB40FGK is equipped with a high precision ball bearing and can be used at ambient temperatures between -10 and +85 °C thus opening up a wide range of application possibilities. A further advantage is the long service life of the fan with 350 000 h (MTBF) at 40°C. The chip cooler assembly HXB40FGK is supplied as a standard component. It can however, be customized.

We specialize in engineering high quality composites for management of heat in electronics packages, particularly Integrated Circuit (IC) packaging. These composite materials are comprised of Molybdenum Copper (AMC) and Tungsten Copper (AWC). Turnkey Solution for Production Ready Pedestals Our advanced thermal management materials are offered both in a raw form such as block or sheet for finished machining at our customers’ facilities or their sub-tier suppliers. We also offer turnkey finished products completed through machining, plating and customer specified packaging. Sizes Our heat spreader materials for IC packages are offered in a wide breadth of sizes including: Standard blocks of 3” (76 mm) x 4” (102 mm) x 12” (304.8mm) Down to finished machined and plated products in 0.015” (0.381mm) cubes Hermetic Housings and Heat Sinks These thermal management products are used as both the hermetic housings and as the expansion-matched

PSL manufacture every type and size of heat sink - including standard extrusion, bonded-fin and liquid cooling plate. We can incorporate fans and embedded pipes, and we provide a full stack assembly service using any type of semiconductor device. Full 3D CAD drawings, thermal simulation graphics, pressure testing, technical advice and consultancy. Prototypes available, volume quantities provided by fixed schedules.

High-performance heat sinks from Seifert electronic are exclusively designed for forced cooling applications. The powerful heat sinks from the Vario and DKL series impress with their large cooling surfaces. Utilizing a finned construction, rib spacing can be manufactured that is not achievable with conventional extruded profiles. Thanks to maximized surface area with the same weight, a high-performance heat sink delivers above-average cooling performance per unit volume. We have patented our proprietary compression geometry at Seifert electronic. In this process, individual fins are precisely cold-pressed into a heat sink without the use of adhesives. Heat conduction in the finned heat sinks occurs directly from the base to the fins, without any thermal transition as seen with pressed-in ribs into a solid base. Custom mounting holes can be incorporated into the pressed, surface-milled base.

Seifert heat sinks are designed for both natural and forced cooling applications. From standard heat sinks to individually machined custom profiles, we offer the appropriate heat sink in the desired profile. The standard heat sinks from Seifert electronic GmbH are classic finned heat sinks, primarily intended for natural cooling. However, these heat sinks can also be utilized for forced cooling with airflow. Thanks to the extensive variety of profiles in our standard range, we can fulfill almost any heat sink requirement. From small transistor coolers to profile giants for IGBT cooling, measuring up to 900 mm in width, we provide the right profile for nearly every application. In addition to our standard profiles, we have access to open profiles, offering the possibility of further variations without incurring tooling costs.

The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. Product Features 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to bulk up to 1380°C).

Protection of sensitive components such as sensors, probes, measuring instruments or semiconductors, such as diodes, transistors thyristors through improving the heat linking to cooling plates or metal housings For optimal cold transfer when using Peltier elements Advantages and benefits Highly effective due to good heat conductivity Electrically insulating Economical due to minimal consumption quantities Resistant to acids and lyes Without significant change in the consistency as well as constant thermal conductivity across the entire temperature range

The Power to Heat system by ELMESS allows operators of  CHP systems with connected heat sink to reduce feeding into the grid by using electricity for hot water. - Biogas plants - Wid farms - Municipal energy suppliers

Aluminium nitride (AlN) is one of the best materials to use if high thermal conductivity is required. When combined with its excellent electrical insulation properties, aluminium nitride is an ideal heat sink material for many electrical and electronic applications.

STOL®95 is a CuCrZr alloy with a combination of very high electrical conductivity and good relaxation resistance, even at an operating temperature of 250°C. This alloy is very suitable for components with medium strength requirements. It is used particularly in applications in the field of mobile devices, as a heat sink, and for highcurrent contacts, for example in hybrid vehicles or photovoltaic technology.

For applications involving very high currents and voltages, Seifert electronic provides heat sinks and mounting brackets designed to apply the appropriate pressure for optimal disc cell cooling. Presspack cells are employed in circuits where very high currents and voltages are present. In such scenarios, disc cell cooling is crucial for ensuring good electrical and thermal transfer. Achieving this goal primarily hinges on the connection between individual presspack cells and the heat sinks in disc cell cooling. This connection must be established with the clamping force specified by the manufacturer. With Seifert heat sinks and the accompanying mounting brackets, also known as clamping brackets, we offer professional equipment for maintaining the correct pressure in disc cell cooling applications. This ensures a high level of durability and robustness, contributing to an extended lifespan of the setup.

For forced cooling, Seifert electronic offers compact fan units in various performance classes. The variable fin spacing in the high-performance heat sinks ensures strong cooling during fan operation. In forced convection cooling, fans are required as separate sources of convection. To ensure optimal convection during fan operation, it is recommended to incorporate heat sink profiles. The fin spacing in heat sink profiles is particularly important, as increasing the surface area is key for forced cooling. To push this boundary further, we have continuously reduced the fin spacing in our profiles. Depending on the model, up to three fans per cooler are possible, which can optionally be equipped with pressure chambers for improved air guidance. Most heat sinks are already equipped with aerodynamically designed hollow fins. Additionally, air deflectors for air guidance are available for some heat sink profiles.

Maximum heat dissipation using PC board heat sinks in minimal board space. Seifert electronic GmbH offers custom heat sinks for use in the board area – precisely measured and flexibly adapted to your requirements. The wide standard range of Seifert electronic includes PC heat sinks in all common designs. We provide various heat sink models such as snap-on heat sinks made of strip material, extruded heat sinks, die-cast heat sinks, as well as finger heat sinks and U-shaped heat sinks, along with the corresponding accessories like mounting clips for fastening. Extruded profile heat sinks are considered classics among PC board heat sinks. We gladly recommend them for use in the board area as they are versatile and can dissipate relatively large amounts of heat.

Aluminum nitride ceramic thermal insulator pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it is featured advantages such as high hardness, corrosion resistance, low dielectric constant and dielectric loss, and low CTE. Aluminum nitride ceramics have excellent thermal conductivity (7-10 times that of alumina ceramics), as the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more people pay attention to it. Regular Size： For Package Type: TO-3P / TO-220 / TO-247 / TO-264 / TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole. TO – 3P, 25*20*1mm (other thickness is available, too); TO-220, 20*14*1mm (other thickness is available, too); TO-247, 22*17*0.635mm (other thickness is available, too); TO-264, 28*22*1mm (other thickness is available, too); TO-3, 39.7*26.67*1mm (Rhombus shape).

Our thermal management and insulation products are far from being just interim solutions. The Thermal Interface Materials (TIM) from Seifert electronic GmbH ensure optimal thermal connection between heat sinks and the components to be cooled. As electronic assemblies become increasingly compact, even a tiny gap between individual components can disrupt the necessary heat dissipation. Air pockets between the heat sink and the component being cooled hinder the optimal thermal connection. Possible consequences include temperature overload, which can lead to overheating in the worst-case scenario. Thermal management and insulation products act as connectors between the heat sink and the electronic component being cooled. They fill every tiny gap between the heat sink and semiconductor with thermally conductive material. This ensures optimal thermal connection and prevents any heat buildup.

IMS (Insulated metal substrate) technology allows the mounting of power components directly on a highly thermally conductive printed circuit board . The result is a compact and reliable solution which, thanks also to the reduced cost compared to systems with traditional heat sinks, is finding more and more application in sectors where effective dissipation of the heat generated by electronic components is required, such as of Lighting, Automotive and Power Supply . The devices can operate at lower temperatures with a guarantee of greater reliability and lifespan , avoiding the assembly phases of mechanical heat sinks. The assembly cycle is simplified and can in some cases be reduced to just the SMT assembly operation. The availability of dielectric layers of different nature and thickness offers many design possibilities from a thermal and electrical insulation point of view. It is possible to use different materials with both aluminum and

IP 65 Waterproof Electrical Box Box By stamping, bending and forming, powder coated. Heatsink By aluminum extrusion, machining and anodized. Assembling Stand off, cable gland assembled.

The YB-WPL-2 Series Full cut off LED wall pack light from Yibai is high-performance wall-mounted luminaires with a slim cut-off body. Engineered to create safe, brightly lit outdoor environments in parking garages and building exteriors with minimal energy consumption and maintenance, YB-WPL-2 Series Full cut off LED wall pack light delivers superior value in a low-profile, architectural style design. Superior thermal management is accomplished through a rugged die-cast aluminum housing with an effective heat sinking design. Samsung SMD3030 LEDs are mounted metal core PCBs which is thermally interfaced to the heat sink for efficient heat transfer. Advanced thermal control maximizes the reliability and lifespan of the LED light engine which delivers years of dependable performance with excellent efficacies and lumen outputs.

The chip cooler of the HXB series by SEPA EUROPE is a compact combination of fan and heat sink and is an attractively priced combination with an adequate cooling capacity. But the development engineers at SEPA EUROPE wanted to go further and this pushing ahead marked the birth of the 3DQler. The cooperation with the experts of APWORKS provided the decisive impulse. Due to the metal 3D printing, also known as additive manufacturing, APWORKS is in the position to produce geometrically highly complex heat sinks. Without having to change the external dimensions or make the fan more powerful, the additively manufactured version can be realized with 30% more efficient waste heat. With the 3DQler, SEPA EUROPE and APWORKS have developed a modern and active cooling concept that offers numerous advantages: Freedom of design with regard to installation space and a reduction of the manufacturing costs.

The significance of air quality measurements whether in industry, households or in vehicles is constantly increasing. Manufacturers therefore, should equip their applications with the optimal sensor fan and in this respect SEPA EUROPE is exactly the right partner! SEPA EUROPE has complemented its range of microfans with the radial fan HY20A with the dimensions of 20 x 20 x 6.3 mm. The air intake of the radial fan which is on one side is 2 l/min and with a sound pressure level of 5dB(A) at a distance of 1m, it is virtually inaudible. As is the case with all microfans, the HY20A is equipped with the reliable Magfix sleeve bearing and has a service life of 400 000 h (MTBF) or 50 000 h (L10) at 40°C. The tachometer output constantly monitors the speed at which the fan is running. The HY20A is also an interesting solution for the cooling of hot spots in embedded applications. This compact blower ensures that optimal use is made of limited installation space.

Even the micro fan MF17B05 from the RaAxial range was a true innovation simply because it can be used not only as an axial fan but also as a radial fan. The micro fan has now a „big brother“– the LF40E05. The LF40E05 provides numerous possibilities for embedded applications. It can be used either as an axial fan with integrated finger guard or as a radial fan in combination with a heat sink. Together with a matching Kühligel® the flat cooling units have a height of approx. 12 mm. In other words, they are ideal for compact applications. In order to achieve the optimum size and heat dissipation, customized dimensions and shapes can be realized. The new model with its 0.15 W power input during operation, is extremely economical with regard to its diverse application possibilities. And that’s not all, the new RaAxial fan has aerodynamically optimized blades that have a significant effect on the noise behaviour. The LF40E05 is thus exceptionally quiet.

The fan and cooling specialist SEPA EUROPE has now added three further models to its slimline radial fan series. The latest additions impress with their compact dimensions of 38 x 40 x 5 mm, 54 x 52 x 6 mm and 45 x 45 x 4 mm and have more than deserved the name „slimline“. All fans are equipped with the reliable Magfix sleeve bearings and have a service life of 210 000 h (MTBF) and 40 000 h /L10) at 40 °C. The PWM input in combination with the tacho output enables the speed to be controlled and monitored. It is not obvious at first glance, but the Model HY45AB05PNK00A tops with a pressure of 143 Pa. The new models will be included in the standard range and will therefore be available shortly from stock. SEPA EUROPE specializes in customized cooling solutions. Thanks to over 25 years of experience, SEPA EUROPE can offer you the appropriate solution for virtually every task.

Chip cooling with the aid of heat sinks usually requires a lot of space and is not only heavy but also expensive. The specialists at SEPA EUROPE have developed a chip cooler with minimum space requirements for compact designs. The core component of the compact cooler is the ultra-flat blower HY40H that is combined with a Kühligel® of pure aluminium. The special feature of the new cooling solution is its variability which means that the size and shape of the heat sink can be freely chosen. Users can thus assemble the cooler to optimally fulfil their requirements. With a thermal resistance of a mere 2.5 K/W, the new chip cooler withstands a power dissipation of up to 15 W and in doing so guarantees the operational safety of the entire embedded system. The blower is equipped with the highly durable Magfix® sleeve bearing and has an impressive service life expectancy of von 210 000 h (MTBF) at 40 °C.

The new super flat active chip cooler of the cooling specialist SEPA EUROPE is a convincing solution for applications in the embedded computing sector, in particular for single board computers. The HZ25B05 with its dimensions of 25x25x6.5 mm can be installed even in flat applications and ensures highly effective heat dissipation. The size of this super flat design is not its only advantage, but also its exceptionally low noise level. The heat sink is made of high-purity aluminium and has low thermal resistance. The integrated micro fan is also equipped with a special, highly durable MagFix® sleeve bearing designed for operating temperatures of up to 80°C. Particularly noteworthy is the fact that the micro fan which is operated with a voltage of 5VDC, has a power input of only 0.3 W and a life expectancy of 400000 hours. The fan can also be equipped, if necessary, with a tacho output for monitoring the function. Both and the fan and the heat sink are available separately.

One of the most popular SEPA EUROPE fans is the axial fan with the dimensions 40x40x10 mm and the popular Magfix® sleeve bearing. This year it underwent complete revision and further development. The new fan generation is known as the LF40P and with the same external dimensions is installed in the same way as the previous model. The new and currently unique rotor geometry is obvious at first sight. It is completely different from the previous shape and layout. Thanks to the distinctive rotor blade with a cut, either a clear noise reduction can be achieved at the same speed or the same noise level as previous generations with 25% more air performance. The current model is equipped with the SEPA MagFix® bearing and PWM input with which the speed can be set to meet the necessary requirements. The LF40P is an excellent example for the permanent further development of products at SEPA EUROPE.

The fan and cooling specialist SEPA EUROPE unveils a true innovation this year: The RaAxial fan. This created term is a combination of the words radial and axial. The microfan with its dimensions of 17x17x4.5mm is ideal for compact, embedded applications and offers numerous possibilities, e.g. as an axial fan for the ventilation of housings or as a radial fan for blowing air onto the heat sink. A tailor-made „Kühligel®“ has already been developed for the latter which makes the cooling of hotspots child’s play when space is limited. Reliability has top priority at SEPA EUROPE. For this very reason the new fan is equipped with the tried and tested Magfix® bearing system. The life expectancy at 40 °C is 210 000 h (MTBF) or 40 000 h (L10).

SEPA EUROPE offers a 40 mm frameless fan especially for embedded systems. It is 10 mm high and provides a compact solution for chip cooling when used in combination with the appropriate heat sink. In addition to the 50 mm frameless fan which is already on the market, the new round 40 mm fan is also a much sought-after model for embedded systems. This is because many standard cooling solutions in this business sector are based on the 40 x 10 mm fan. Strictly speaking, the 40 mm fan has a rotor diameter of 37 mm. The version offered by SEPA EUROPE is equipped with two ball bearings and can boast a remarkable service life of 70.000 h at a temperature of 40°C. In addition to an impulse output for speed monitoring, it also has a PWM input for speed setting in the range of approx. 35 – 100% of the nominal speed. In conjunction with the power block pin-fin heat sink, this virtually silent fan with 22 dB(A) is also available ready for connection in the „Kühligel“ version.

Passive cooling solutions are usually too big. Small active heat sinks are the ideal solution. Stable light colours, a high life expectancy and low energy requirements are the unbeatable advantages of LED technology. However, whereas the energetic superiority comes virtually automatically, considerable investment must be made in thermal management to fulfil the demands on the colour values and service life. Only well cooled diodes can keep what they have promised in the long run. For optimum thermal management, SEPA EUROPE offers not only passive cooling solutions but also active heat sinks. Active cooling concepts usually provide the ideal solution when space is a problem. They are smaller and lighter, can attain the desired service life, are attractively priced and find space virtually everywhere. SEPA EUROPE already supplies its customers with fans that are adapted to the application in question and in some cases with special waterproof fans.