Printed circuit board - Import export

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm 2.

Origin: China Model Number: JXPCBML1 Min. Hole Size: 0.2mm Board Size: Custom made Layer: 8 Layer Testing point: 3600 Minimum Annular ring: 4mil Minimum solder bridge: 0.08mm Solder mask color:  Green PCB Standard: IPC-II Standard Warp and Twist: 0.75% Certificate: ROSH. ISO9001. Application: Aerospace Recorder Number of Layers: 8-layer Base Material: FR-4 Copper Thickness: 1oz Board Thickness: 1.6mm Min. Line Width: 4mil Min. Line Spacing: 4mil Surface Finishing: Immersion Gold Supply Ability: 20000 Square Meter/Square Meters per Month