3D-MICROMAC AG

- Formats from 1/2 to 1/6 cells and sizes up to M12 - Free-form cutting - Power increase of up to 2W through TLS technology 3D-Micromac's patented laser technology for direct cutting of solar cells is the leading method for cutting cells. When conventional cutting methods reach their limits, TLS technology with ultra-short pulses comes into play. Excellent cutting qualities with high reproducibility and accuracy can be guaranteed. Whether half-cell, third-cell, quarter-cell or the trend-setting six-cell. The great flexibility of TLS technology makes it possible to provide our customers with comprehensive support. Adaptation in the number of cell cuts, variation in the size of the substrates up to 220mm or a high flexibility in the freedom of shape. From silicon-based cell types such as PERC, TOPCon, HJT to IBC, the processing of your mono- and polychristaline photovoltaic cells is possible.

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Besides the processing of rigid and flexible materials on rigid substrates, we also offer the processing of flexible materials using sheet-to-sheet or roll-to-roll processes: - Laser micro structuring and ablation - Laser processing “on-the-fly” or “step and repeat” - Roll width up to 300 mm possible

The production of ophthalmic lenses requires different marking processes, e.g. technical engraving and branding for spectacle lenses as well as UDI marking for contact lenses. 3DMicromac offers ophthalmic marking solutions for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking and guarantee Highest engraving precision Accurate contrast adjustment Reliable process stability Maximum throughput Top availability Flexibility in system configuration and Simple retrofitting. 3DMicromac‘s customers can choose between premium quality excimer laser systems and high quality maintenance free DPSS laser systems. Both are suitable for the production of technical engravings and visible branding on blocked and unblocked lenses, as well as contact lenses. The microMARK™ MCF excimer laser system generates the engravings by cold laser ablation of 193 nm UV radiation.

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

3DMicromac’s brand new microCETI™ uses the most innovative LIFT (Laser Induced Forward Transfer) laser process, which is an essential factor in the process chain for manufacturing microLED displays. The fully integrated laser system is characterised by its compact footprint and high variability. The microCETI™ enables the transfer of hundreds of millions of microLEDs without the use of mechanical forces, thereby ensuring that microLEDs of almost any shape and size can be transferred. This ensures cost-effective production of microLED displays. Most cost-effective production of microLED displays Unique LIFT module Highest transfer rate ten times faster than competing technologies Flexible software for integration into production lines Handling options for wafers (up to 8″) and sheets (up to Gen.2)

3DMicromac’s microMIRA™ LLO system provides highly uniform, force free lift off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The laser system can be used for a variety of applications, such as GaN lift off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing. Additional applications include laser annealing and crystallization for surface modification. Force free and extremely fast line beam laser processing No damage due to thermo-mechanical effects Low production costs Elimination of costly and polluting wet chemical processes Integration of adjacent manufacturing steps for higher fab productivity

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system