DIENER ELECTRONIC GMBH & CO. KG

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tretra 320R low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 320 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

The Vacuum Chamber VC P700D is made of a unique, flexible chamber system based on extruded aluminium profiles. The three meter long profiles are cut to the desired length and equipped with a bolted rear wall and a door. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Excellent thermal conduction ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 1000 mm, 1400 mm) Inner diameter: 640 Ø Outer diameter: 700 Ø Front panel (optional): 18 U (1 U = 44.45 mm) Connections 2 x KF 16 2 x KF 40 2 x ISO K 63 Additional flanges possible in any position

A cost-effective process for activating plastic and elastomer surfaces is treatment with the APC500. Using air as the process gas, large surfaces can be activated under atmospheric pressure. An arc is ignited between two electrodes in an inhomogeneous field. The voltage is about 10,000 V. In the discharge zone, the air flowing through is ionised. The plasma is blown out of the electrode area by the air flow. The substrate can now be treated in the emerging corona. A strip several centimetres wide is treated in the corona. With several parallel plasma generators it is possible to treat surfaces. Due to dangerous voltage potential, PlasmaAPC 500 is only suitable for non-conductive materials. PlasmaAPC 500 is suitable as a pre-treatment unit for the following processes: Bonding, printing, painting. The following surfaces can be treated with PlasmaAPC 500: Plastics, rubber, ceramics, glass.

The VC M600² is based on our new modular chamber system. The system consists of individual, fully milled aluminum modules with a depth of 500mm. Thus the length of the chamber can be variably set in 500mm steps. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: 1000 mm (modular in 500 mm steps) Width: 600 mm Height: 600 mm Connections 2 x KF 16 6 x KF 40 1 x ISO K 63 1 x ISO K 160 Additional flanges possible in any position

Specially developed for use under high vacuum, our vacuum chamber VC P400x400 HV is made of a unique, flexible chamber system based on extruded aluminium profiles. The three-metre long profiles are cut to the required length and fitted with a screwed rear wall, as well as a door. Unlike our standard VC P400x400, the VC P 400x400 HV has no slots in the side walls. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 625 mm) Width: 400 mm Height: 400 mm Connections 1 x KF 16 6 x KF 40 Additional flanges possible in any position

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam DUO atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 45 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 45 litres of this plasma system offers enough space to serve series production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Plasma systems from Diener electronic have long since established themselves in a wide range of industrial sectors. With the Tetra 1440 low-pressure plasma system, you can rely on modern and future-proof cold plasma technology in a vacuum. The chamber volume of approx. 1440 litres of this plasma system offers enough space to serve series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma is generated by applying high-frequency voltage in the vacuum chamber. In the process, the process gas introduced there is ionised. Fields of application: VOC-free cleaning of organic residues Activation before painting, gluing, potting, ... Etching of PTFE, photoresist, oxide layers, ... Super-hydrophobic and -hydrophilic coatings

Parylene is the short name for the polymer group of poly-para-xylylene. Parylene coatings offer a wide range of benefits. Parylene ... are fully conformal: i.e. they adapt to complex substrate contours such as sharp edges, drill holes or blind holes are pinhole-free from a film thickness of approx. 0.5 µm. are chemically insoluble and resistant to a wide range of chemicals. have very good barrier properties against moisture and chemicals. have a high dielectric strength. have dry lubricating properties (low coefficient of friction). are hydrophobic: contact angle of H2O between 92 ° and 98 °. are transparent between 90 and 96 % in the visible wavelength range (depending on type). are biocompatible: types C and N parylene can be deposited, which can be certified according to USP Class VI, ISO 10993 and FDA.

The Vacuum Chamber VC P305X300 is made of a unique, flexible chamber system based on extruded aluminium profiles. The three meter long profiles are cut to the desired length and equipped with a bolted rear wall and a door. ✓ Flexible length of max. 3 meters ✓ Very fast delivery because only door and back wall must be supplemented ✓ Low-cost ✓ Low-weight ✓ Low desorption of the aluminium, therefore also suitable for high vacuum ✓ Highly clean processes possible, e.g. in the semiconductor field ✓ Easy operation ✓ Easy attachment to the existing division bars Vacuum chamber specifications Internal dimensions Length: up to 3000 mm (standard: 370 mm, 620 mm) Width: 305 mm Height: 300 mm Front panel (optional): 9 U (1 U = 44.45 mm) Connections 1 x KF 16 5 x KF 40 Additional flanges possible in any position