Silicon nitride (Si3N4) is a high-melting-point material with high fracture toughness and excellent thermal shock resistance, It is considered to be one of the few monolithic ceramic materials that can withstand severe thermal shock and thermal gradient generated by hydrogen and oxygen rocket engines.
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Silicon Nitride Ceramic Bar: Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, high-strength ceramic material is used as an alternative to stainless steel, super alloys, tungsten carbides and first-generation ceramics such as Al2O3 and ZrO2. It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials. Silicon Nitride (Si3N4) Characteristics: >Good thermal shock resistance >Creep resistance >Low density >High fracture toughness >High hardness and wear resistance >Electrical resistivity
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Silicon Nitride (Si3N4) is 60% lighter than steel but strong enough to survive some of the most demanding applications in a variety of industries. This lightweight, the high-strength ceramic material is used as an alternative to stainless steel, super alloys, tungsten carbides, and first-generation ceramics such as Al2O3 and ZrO2. It offers excellent thermal shock resistance and high fracture toughness, compatibility with nonferrous metal melts, and improved structural reliability compared to other ceramic materials. When extreme conditions like these push equipment to its limits, Silicon Nitride (Si3N4) industrial ceramics deliver high performance where other materials fail. Typically, Heavy-duty diesel engines. Jet engine igniters. Oil wells thousands of feet underground. Applications for silicon nitride include: Foundries Electronics Oil & Gas Automotive Aerospace
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With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
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The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. Product Features: 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to 1380°C).
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