Testing Services

TSE’s design team creates custom connectors incorporating: component design and material selection, design for manufacturing (DFM) technique.

The ablation of fine wires by laser technology is a precise technique that involves the controlled removal of material from conductive wires, enabling numerous applications across various industries.

AMETEK EMC can provide packaging solutions for every need, with capabilities for applications such as: sealed pouches, anti-static bags, custom boxes, multi-material packaging, shock and vibration sensitive packaging, target component protection, and packaging for sterilization.

Automated control and manipulation of fine wire as small as 50AWG allows for twisting, cabling, reel-to-reel laser processing, and precisely ablated discreet lengths for applications that range from subcutaneous biometric sensors to implanted pacing leads and high-density wire harnesses for imaging catheters. High-density wire harness assembly is vertically integrated made possible through a combination of fine wire cabling and the dressing and termination of high-count cable to tight pitched circuitry.