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Wafer bonding - Germany

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MICROFAB SERVICE GMBH

Germany

MICROFAB – your MEMS MANUFACTORY. PRODUCTION of customer-specific microsystems. microfab is an independent service provider in the field of silicon-based MEMS technology and a global developer and manufacturer of customised microsystems. Our production lines, located in two cleanrooms, feature state-of-the-art facilities that permit silicon and glass wafers of 100 to 150 mm to be processed. With quality as a top priority, we have achieved certification according to DIN EN ISO 9001: 2015, regardless of whether this relates to developments or manufacturing with large or small production volumes. Your design of microsystems or special components serves as a basis for us to decide which production technologies are most suited to putting your ideas into practice

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ALUMINA SYSTEMS GMBH

Germany

CERAMIC METAL COMPONENTS FOR USE IN HIGH-TECH APPLICATIONS. Vacuum-tight metal ceramic composite components – manufactured from the high-performance material aluminium oxide and a metallic join partner – are the core business of Alumina Systems GmbH. These components are used where switching of maximum energies is involved, e.g. in energy, laser, X-ray, plasma, medical and accelerator technology. A great advantage of technical ceramics is the high electrical insulation up to high temperatures. Fields of application are, for instance Sensors in ship engines (thin-wire bonding), precursor gas distributing rings with wafer coating (PE-ALD) or small engines for satellites. Here, ceramic composite components first allow the application to be realised. In addition to standard products like electrical feedthroughs, vacuum switching tubes or vacuum insulators, the demand for customer-specific high-end applications is constantly increasing. At Alumina Systems, mechanical/thermal stresses on a component are simulated here via the finite element method (FEM) even before the actual construction of the component, and the most suitable design for the application is thus selected – without having to produce a real component.

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Wafer bonding - Germany

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