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Wafer test - Import export

  1. FEINMETALL GMBH

    Germany

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    FEINMETALL GmbH. Precise and sophisticated contact solutions are an important success factor particularly for testing electric and electronic components and products. Feinmetall offers comprehensive contact solutions for the electronics, automotive and semiconductor industries, thereby providing an important contribution for your quality management. Both of the company's product groups, namely test probes for contacting printed circuit boards or cable harnesses, as well as probe cards for the semiconductor test, complement each other perfectly, resulting in unique skills in cutting-edge precision. For over 50 years, Feinmetall has been a reliable partner in the international high-tech industry. The company is therefore represented worldwide with sites in the USA, Czech Republic, Tunisia, Mexico, Singapore, Taiwan and China, as well as headquarters in Germany.

  2. M.D. MECHANICAL DEVICES LTD

    Israel

  3. BIWIN STORAGE TECHNOLOGY LIMITED

    China

    Corporate Overview: Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.Full range of Product Line: Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.State-of-the-art Manufacturing: -Quality Guaranteed Products-Strict Quality Control Standards-Short Lead Time-Low Product Defect Rate-Large production Capacity

  4. NT-MDT LLC

    Russia

    NT-MDT LLC develops research instrumentation and scientific equipment: scanning probe microscopes, systems combining methods of scanning probe and optical microscopy and spectroscopy. The latest developments of NT-MDT S.I. include laboratory instruments and tools: • automated AFM VEGA with 200 mm wafer holder; • NTEGRA Nano IR combined system; • NTEGRA Spectra II automated combined system; • NEXT II fully automated AFM/STM for scientific research; • SOLVER Pipe II AFM for non-destructive tests of engineering materials. Key features of the scientific research equipment by NT-MDT are: • the widest range of AFM modes delivered in standard configurations • the highest level of automation at different levels, including self-testing, automated configuration for the selected AFM mode, adjusting the AFM sensor, laser alignment, tuning of scanning parameters, correlating video and scanned images; • lowest thermal drift The NT-MDT team has been developing and manufacturing equipment for studying the properties of nanoscale objects and has been providing support of research instrumentation and scientific equipment for over 30 years. The brands NT-MDT and NT-MDT Spectrum Instruments are recognized by scientists around the world. The company has produced more than 4000 scanning probe systems and microscopes for laboratories in 60 countries. NT-MDT LLC distributes its products through representative offices in Russia, Europe, USA and China.

  5. LAYTON TECHNOLOGIES

    United Kingdom

    LAYTON TECHNOLOGIES is a Manufacturer of critical cleaning and drying equipment for manufacturing. We supply a wide range of equipment from parts washers, small bench for type ultrasonic immersion tanks through to more complex designs. From multi-stage aqueous ultrasonic cleaning and passivation lines, low emission sealed solvent vapour degreasers, low flash point solvent machines and all types of dryiers including forced air dryers, vacuum and solvent vapor dryers. - AEROSPACE - Cleaning and drying of aerospace components during manufacture and M.R.O. - DEFENCE - Turnkey projects ranging from cleaning aerostructures to infra-red components. - ELECTRONICS - Precise consistent removal of residues and particulates prior to conformal coating. - MACHINING - Innovative solutions to achieve clean, dry, particulate free components. - MEDICAL DEVICES - Achieving consistency, traceability and process validation for risk reduction. - SEMICONDUCTOR - Streak free cleaning, etching, stripping and drying of wafers, PCBs, LCDs etc. ***** Ultrasonic Equipment Mnfrs, Manufacture of instruments and appliances for measuring, checking, testing, navigating and other purposes, except industrial process control equipment

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  1. WEKON TECHNOLOGY CO., LTD.

    China

    Wekon Technology Co., Ltd. is a professional provider of optical test instruments, particularly fiber connector optical interferometer, wafer counter, diameter gage, fiber concentricity gage, etc.We have an excellent R&D team leaded by the co-founder, Dr. Kaiwei Wang, who has been working in the field of optical technology for more than ten years.Up to now, the company has launched two products, WKFI-1 Fiber Connector Optical Interferometer and WKFI-2 Automatic Fiber Connector Optical Interferometer, for the 3D geometry measurement of the end faces of optical fiber connectors with international standards such as IEC and Telcordia.We dedicate ourselves to product research and development, and strive to deliver innovative and superior optical test instruments worldwide.

  2. STANDARD SYSTEMS

    South Korea

    We are a " IC Packaging Service" provider for IC design and fabless companies. We use good sub- contractors in Korea and other Asia area for IC assembly into various package types with extensive experience. Linked sub-contractors are located mostly in Korea, Thailand, and China.., etcProvide IC packaging services to assemble die in wafer form to various package types: BGA, QFP, SO, QFN, TSOP, PDIP...., And We wish to work for Fabless and IC Design companies.Semicondcutor Assembly Services to package die in wafer form, and Packages: BGA, QFP, SO, TSOP, QFN, PLCC, PDIP....etc We can supply Molded Dummy QFN strips for saw blade test(QFN strips with mold encapsulation). The unit sizes are available for various sizes from 2 mm SQ. Most of package types are available; SiP, Stack-CSP, SoC, BGA, QFP, QFN/MLF, SO, DIP.., etc. You can use good qualified semiconductor(ICs, Discrete)assembly OEMs through our company. We will serve you all your inquiry and request.Thanks, Standard Systems