Processing technology - Import export

SCHOCK’s core competencies include roll forming technology with a large number of integrated processes. With our roll forming technology we are able to produce individual and high-precision profiles or complete assemblies for our customers.

Cyclone III Device Family Overview Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants: ■ Cyclone III—lowest power, high functionality with the lowest cost ■ Cyclone III LS—lowest power FPGAs with security With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software

The Spartan®-6 family provides leading system integration capabilities with the lowest total cost for high-volume applications. The thirteen-member family delivers expanded densities ranging from 3,840 to 147,443 logic cells, with half the power consumption of previous Spartan families, and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the Spartan-6 family offers a new, more efficient, dual-register 6-input lookup table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices

Milk storage tanks Asepting tanks Yogurt production tanks Milk pasteurizes Equipment for curd cheese production Milk floats Milk accounting systems Technological process automation

The right mix From basic to high-tech, FRIMO offers peripheral equipment for all PU processing technologies.

Ideal for trimming or scoring foils and skins FRIMO's scoring process technology was developed for producing hidden airbags in instrument panels. In contrast to composite component weakening in which the substrate, foam and skin are all weakened in one step, FRIMO prefers material specific single steps. The foil or skin is weakened by blade before foaming. The substrate and foam are separately weakened at the end, which can easily be integrated into the necessary component cutting process. Depending on the customer-specific requirements, this is where FRIMO punching machines or milling machines come into play. Compared to weakening entire composite components (for example, with a laser), a lower investment is required. For the weakening of leather parts for hidden airbags, FRIMO offers a patented process in which the skin is weakened by a rotating circular knife. This process guarantees high precision and odorless results with the shortest possible cycle times.

Leading the market Leather laminating is found mainly in the automotive industry. High quality vehicle interiors are characterized by a sophisticated design made of perfectly processed and adapted materials. Leather surfaces are no longer exclusively reserved for premium vehicles; they are also becoming increasingly used in high volume and mid-priced vehicle interiors. As a natural material, leather presents tough processing challenges. Variations, quality/quantity requirements and numerous project-specific parameters demand smart manufacturing solutions that can only be produced with extensive experience and in-depth technology and process expertise. FRIMO's tooling and equipment technology in leather processing leads the market. Along with leather laminating come leather back-foaming and leather scoring for hidden airbags.

The LF-TA transmitter of Schaller measurement instrumentation, with its robust and easy to mount aluminium housing, is best suited for all applications in this field. For temperatures of up to 60°C for laboratory, climate control and drying technology, wood processing industry, food and animal feed industry, building industry, printing and paper industry, agriculture, biotechnology and pharmaceutical industry.