Printed circuit design - Import export

Printed circuit board design services is one of the ways that we help our customers get to market faster as our engineering team has significant real world experience designing PCBs for performance and manufacturability.

PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.

These are specific materials for use in the thermoelectric sector and in thermo-mechanical applications. The range includes: Mica Continua Muscovite / Phlogopite is available in rigid or flexible sheets, tubes and / or shaped particles according to customer specifications. The main applications are in the following sectors: household appliances, packaging, lighting and electric heaters. Cementitious or calcium silicate based asbestos substitutes for all thermo-mechanical applications up to 1000 ° C Antistatic laminate to be used as a soldering template for printed circuits Misoglass1 / Deltherm1 have been designed to be used in all applications where thermal insulation is required under compressed conditions.

PCB depanelization is a process step in the production of large-scale assembly of electronics. To increase the throughput of printed circuit board (PCB) and surface mount (SMT) production lines, printed circuit boards are often designed to consist of many smaller individual printed circuit boards that will be used in the final product. This PCB cluster is called a panel or multi-block. The large panel is broken or "depanellated" as a process step - depending on the product, this can be right after the SMT process, after the in-circuit test (ICT), after soldering through-hole components, and even just before the final assembly of the PCBA in the enclosure.

Product Features: • Desktop electronic instrument enclosure, ideally suited for mounting printed circuit boards. • Designed to meet IP54. • Two sets of vertical 1.5mm (0.062") P.C. board guides are moulded into case halves front and rear. • Integral horizontal P.C. card mounts on Eurocard centers. • P.C. card standoffs moulded into top and bottom half of enclosure - require #6 x 1/4" (6.4mm) screws - part number 1598ATS100.

Product Features: • Electronic instrument enclosures, ideally suited for mounting printed circuit boards. • Ergonomically designed for a comfortable fit into the user's hand. • Designed to meet IP54 ratings. • Recessed top for membrane display or pad. • Units with battery door use the long life "three snap" door. • Lap joint construction provides protection against dust accumulation and splashing water. • Moulded in a choice of black, grey or transparent blue general purpose ABS plastic with a satin texture. • Unit is secured with self tapping screws. • Black and transparent blue enclosures include black screws, grey includes nickel finish screws.

Product Features: • Electronic instrument enclosures, ideally suited for mounting printed circuit boards. • Ergonomically designed for a comfortable fit into the user's hand. • Designed to meet IP54 ratings. • Recessed top for membrane display or keypad. • Units with battery door use the long life "three snap" door. • Lap joint construction provides protection against dust accumulation and splashing water. • Moulded in a choice of black, grey or transparent blue general purpose ABS plastic with a satin texture. • Includes one or two aluminium end panels. • Unit is secured with self tapping screws. • Black and transparent blue enclosures include black screws, grey includes nickel finish screws.

Product Features: • Electronic instrument enclosures, ideally suited for mounting printed circuit boards. • Ergonomically designed for a comfortable fit into the user's hand. Also suitable for desktop use. • End panels are removable for easy modification, or can be replaced with specially designed rubberized cord grips. • Recessed top for membrane display or keypad. • Lap joint construction provides protection against dust accumulation and splashing water. Designed to meet IP54 requirements. • Moulded in a choice of black or grey flame retardant ABS plastic with a satin texture. • Unit is secured with (4) self tapping screws. Except for sizes C1 and D1, snap closures are present near the middle of the enclosure wall for added sturdiness. • Black enclosures come with black screws, grey enclosures come with nickel plated screws. • Rubberized cord grips and wall-mount holder accessories are available (sold separately).

Product Features: • Designed for EMI/RFI shielding applications - using conductive plastic (a compound of plastic and stainless steel fibers). • Electronic instrument enclosures, ideally suited for mounting printed circuit boards. • Thick wall design with an average wall thickness of 0.13" (3.3mm). • Moulded from a compound of stainless steel fibers and flame retardant ABS plastic (carries a UL flammability rating of 94V-0). • Designed to meet IP54. • Note: Material is brittle - acts like phenolic - Not for high impact use. • Countersunk lid is secured with four M3 x 0.5 - 0.71" (18mm) long, Philips machine screws threaded into integral brass bushings. Perfect for applications with repetitive assembly and disassembly are required. • Black with matte textured finish.

When you are looking for substrates for electronic circuits with a high thermal conductivity and a low expansion coefficient (CTE), ceramic pcb will be your preferred choice of material. Today ceramics are already widely used as substrates in many microelectronic components and power LED packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are Chip-on-board (COB) modules, High power circuits, proximity sensors, battery drivers for EVs, … .

We carry out a full cycle of development of electronic devices: supply of electronic components, stencils and printed circuit boards, design of electronics, redesign of finished devices. Applying the principles of lean production, we achieve a price reduction while maintaining a high quality of services. Due to quality control at all stages of production, we have the reject rate less than 0.5% (at observance of all requirements to the order). Operative daily planning allows us to achieve maximum efficiency in the use of working time. Thanks to that, in the presence of all the equipment in the warehouse, we can take the order to work during the day from the moment of order. We have our own high-tech equipment, and offering good quality with competitive assembly cost.

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

Ceramic prined circuit board feature many advantages over metal core and FR4 circuit boards as they combine excellent thermal characteristics with low a expansion. They are also suitable for multilayer applications, show lower deformation, warpage and operate under higher temperatures. Elite advanced technologies is your partner for ceramic substrates and circuit boards. Thanks to our large laser facilities and patented printing technology we are able to accomodate both very tight tolerances as well as high volume production at a high quality.

Multilayer PCB circuit board is a kind of printed circuit board composed of alternating conductive pattern layer and insulating material laminated.