Wafers - Import export

After the surface grinding, the crystal is sliced into wafers with a thickness according to customer’s specifications. Sawing machines with diamond impregnated blade are used for the slicing. We have got 5 sawing machines with a monthly capacity 2500 kg. Maximum diameter Ф152 mm. Wafer thickness up to 80 mm. Slicing accuracy ± 25 microns.

Wafer thickness(μm) standard >350 >400 >440 >500 minimum 300 350 380 420 Through-the-thickness accuracy(μm) standard ±15 ±20 ±20 ±20 Thickness deviation TTV (μm) maximum 10 15 20 25 standard <7 <10 <10 <12 ИWafer warp (μm) maximum 30 35 40 45 standard <15 <15 <20 <25

There are many types of wafer carriers, and each has its own application. For example, the front-opening wafer transfer box FOUP can be used in the semiconductor process in the manufacturing plant, the front-opening wafer transport box FOSB can be used for transportation between manufacturing plants, and the wafer flower basket can be used. for wafer cleaning, etc. Fluororesin has an extremely stable molecular structure, so it is hardly affected by light, temperature and chemicals, and is the "king of resins" that subverts the inherent concept. In the process of cleaning chips, high-purity chemicals are required, and fluoropolymers are the only materials that can contain and transport the high-purity chemicals used in the manufacturing process, achieving the extremely high stability and purity required for semiconductor manufacturing.

Package Quantity : 12 x 700g Artikel Nr: 68205 Grams: 700g

The DW292 is specifically designed for cutting monocrystalline silicon ingots up to 300mm diameter into high quality wafers for the semiconductor industry. The newly developed DW292-300 can be operated with slurry wire, as well as with diamond wire, and has sophisticated features for optimizing warp and ripple. The longer wire field, as well as the higher wire speed and acceleration, enable a higher throughput per machine and year. The use of extremely thin wire is possible thanks to smaller inertia of moving parts, fewer deflection rollers and shorter wire distance. The DW292-300 is highly resistant to temperature fluctuations and vibrations due to its compact and robust machine frame made of mineral casting. Thanks to higher process automation and the new intuitive HMI with dialog-based production wizard, operation is safer, easier and faster.

ISO 5211 for Direct Mount, Epoxy Coated Ductile Iron Body, Stainless Steel Disc, PTFE Liner, Locking Lever Operation 1½” to 12”, Gearbox Operation 14” to 24”, Complies with 97/23/CE (PED) Directive CE 1115 Rated PN16 1½” to 12”, PN10 14” to 24”, Temperature -10°C to 120°C. Note: Gearbox Operation Available for all sizes, please enquire. 1½” to 16” to fit PN6, PN10, PN16, ANSI 150, Table D and/or Table E Flanges. 18” to 24” to fit PN16 Flanges.

Silicon is the most common semiconductor and the most widely used in the electronic and technology sector. There are different silicon fabrication methods including the horizontal gradient freeze method and vertical Bridgeman method. Silicon is the principal platform for a semiconductor device, a wafer is a thin slice of this semiconductor material, which serves as the substrate for a microelectronic device built in and over the wafer. Silicon wafer’s primary use in integrated circuits which power many of the products that modern society uses every day. Computers, smartphones and solar cells are only three products that are dependent on this technology. although other semiconductors have been tested over time, silicon has proved to be a stable option.

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Wafer rolls with different fillings. Fillings: - Hazenut Flavor - Cappuccino Flavor - Vanilla Flavor - Ice-cream Flavor - Cocoa Flavor - Condensed Milk Flavor - Baked Milk Flavor

waffles with different flavors: walnut, strawberry, milk, chocolate, lemon, vanilla ...

77 is one of 5 other brands consisting of wafers, biscuits, cakes, marshmallow biscuits........

77 is one of 5 other brands consisting of wafers, biscuits, cakes, marshmallow biscuits...

Voa is one of 5 other brands consisting of wafers, biscuits, cakes, marshmallow biscuits

VOA is one of 5 other brands. Brands consisting of wafers, marshmallow biscuits and cakes.

Turn Key Wafer Production Line..

Automatic wafer production lines, horizontal flow pack machines and automatic feeding systems for many kind of confectionery products like, chocolate bars, wafers and cakes.

Germanium wafers are a semiconductor material & therefore are a smart choice for microelectronics. Due to its unique electric properties, it is widely used for sensors, solar cells and infrared optical applications. The wafers are also great for microelectronics as the space is limited and being available in 500μm or less it makes it perfect to achieve the high quality results required. It’s thermal conductivity makes it a good alternative to silicon. Our stock wafers are produced as thin as 500μm and provide exceptional surface quality. However, we can manufacture to a fully customised specification with a wafer thickness as little as 10 μm. Typical specifications of our germanium wafers are: 10mm – 150mm in diameter <500μm in thickness Doped and undoped Germanium

The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.

Filling Volume: 400 ml Volume Brimful: 460 ml Container Weight: 16 gr Lid Weight: 4 gr

The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. Product Features： 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to 1380°C).

100 110 111

Product name: 2-12 Inch Orientation 100/111/110 SSP Prime/Dummy Grade Silicon Wafer Place of Origin: China Material: Silicon Diameter:2-12 inch Thickness: 100-1500um Orientation: 100/110/111 Type/Dopant: intrinsic or P/B or N/Ph Grade: prime/dummy Bow/Warp:<30um TTV:<10um Surface finish: SSP/DSP Supply Ability: 20000 Piece/Pieces per Month Packaging Details:Stardand Package Port of shipment: Xiamen,China Lead Time :25-30days

Tweezers with five teeth with flat lower tip for wafer handling, Length 125mm

New version of vertical contact technology with focus on increased service life and other advantages.

thicknessGAUGE C.LP sensor systems use laser profile scanners for the thickness measurement. These scanners project a laser line onto the surface to be measured. The laser line compensates for strip tilting and enables profile averaging. The laser line measuring technique makes it possible to measure the thickness of structured materials such as embossed surfaces and perforated plates.

The IC2001/USB single-channel converter cable is used for the USB connection of optical sensors equipped with an RS422 interface. The cable is easy to install and can therefore be used in machines and facilities.

Wafers with maximum dimensions 200x200 mm are being lapped. Capacity – 1000 kg/month. Surface roughness – ˂ Ra 0.1

NESTLE KITKAT CHUNKY WAFER