AlN (Direct Plated Copper) Metallized DPC Substrate

Aluminum nitride ceramics have excellent electrical and thermal properties, and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper cladding method (DBC), etc.

Mo Mn Ceramic Feedthrough Ceramic Vacuum Electrodes The Ceramic Surfaces for Brazing, the surface must be metallized. Compare to Glass seal, Ceramic seal has exceptional resistance to thermal and mechanical shock as well as corrosion. While it requires more complex manufacturing processes and sophisticated engineering, the price is obviously higher. Advantages of Ceramic-to-Metal Seals * More solid, durable hermetic seal and better electrical insulation * Used for more harsh conditions, such as high and low (cryogenic) temperature, corrosive, high pressure, and high vacuum environments * High mechanical strength, less fracture when applied to high vibration and high g-load conditions * Shows strong bond and an excellent seal with metals and alloys, such as copper and Cu alloys (CuNi) and to nickel and Ni alloys.

INNOVACERA® Ceramic hot surface igniters for pellet boilers only need approx. 1/10 of the energy of that needed by hot air fans and ignition blowers. Their ignition capacity lies between 120 and 350 W. Depending on the positioning of the ignition element in the boiler, the ignition time of approx. 60 seconds is extremely short. This also means minimal emissions. Specification: Voltage: 120V / 230V Power: 150W / 170W / 200W / 230W Tube Size: OD10.5 × ID6.5 × L78 mm Supporting Socket: NO.7 Lead wire: 300mm / 400mm / 500mm / 900mm (Customized is accept) Range of temperature: 800~1100 °C Applications: Kerosene fan heater Wood pellet, wood chips stove or boiler Small scale biomass industrial furnace ignition Incense burner

The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics Alumina ceramic substrate / plate specification: 10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc. Can be made according to your requirements.