United Kingdom
Manufacturer/ Producer
EXPANDO is a fabless semi-conductor manufacturer offering a portfolio of standard Integrated Circuit products, as well as the design and manufacturing expertise to develop custom solutions (ASICS): - ARINC 429, 571 & 575 ICs - Power Control ICs - Discrete to Digital ICs - Lighting Control ICs - Custom, bespoke ASICs (Application Specific Integrate Circuits) *These circuits provide lightning protection High Performance, ruggedised and bespoke computing solutions optimise space, weight and power, are inexpensive to own and are tested and approved to military standards for performance in harsh environments: - Ruggedised Enterprise Servers (RES) - High Performance GPGPU Computers - Hyper Converged Infrastructure Platforms - Rugged Switches - Small Form Factor Tactical Systems - Board-Level Computers and Legacy Systems Miniaturised, ruggedised electronics products for reliable, highperformance operation in harsh environments : - Memories: DDR, SRAM, SDRAM, MRAM, FLASH, PROM, EEPROM - μSSD: PATA/SATA - POL Converters - Interfaces: LVTH/LVDS/SERDES - Micro Camera Heads - Custom designed System in Package Tactical data solutions to cost effectively adapt obsolete or legacy protocols to Ethernet based networks: - NTDS/ATDS over Ethernet/Fiber. - Interface Adapters (PCI/PMC/VME/ISA) - Cables and Connectors - Tactical Data Processors - UAV Link (Portable UAV Maintenance)
China
Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen
Request for a quoteChina
Origin: China Model Number: JXPCBML1 Min. Hole Size: 0.2mm Board Size: Custom made Layer: 8 Layer Testing point: 3600 Minimum Annular ring: 4mil Minimum solder bridge: 0.08mm Solder mask color: Green PCB Standard: IPC-II Standard Warp and Twist: 0.75% Certificate: ROSH. ISO9001. Application: Aerospace Recorder Number of Layers: 8-layer Base Material: FR-4 Copper Thickness: 1oz Board Thickness: 1.6mm Min. Line Width: 4mil Min. Line Spacing: 4mil Surface Finishing: Immersion Gold Supply Ability: 20000 Square Meter/Square Meters per Month
Request for a quoteGermany
The new UBX flow monitor is designed with all components so that it simply runs smoothly even under harsh climatic conditions. You can count on it.
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