Adhesive strips - Import export

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.65 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.80 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 1.27 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 2.54 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0. 40 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with rectangle pads in parallel order Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 14 self-adhesive strips with quadro-pads Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 17 self-adhesive strips with potential strips Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with square-pads in parallel order Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with staggered square and rectangle pads Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0.50 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Surface chem. Ni/Au 12 self-adhesive strips in pitch 0. 635 mm Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Opening systems in material: pulling-action strips, adhesive pulling-action strips, asymmetrical pulling-action strips. For more infos check our webpage in the website description.