Machine assembly - Import export

Our process-controlled assembly machining up to the manufacture and delivery of complex assemblies rounds off the range of production and services within SCHOCK.

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for machine assembly (Pick & Place) of Fine-Pitch QFP 256 QFP 256 4 x Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for solder practices for SMD Fine-Pitch QFP 208 QFP 208 4 x For manual soldering and very suitable for machine assembly (Pick & Place) Size 100 x 140 mm

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm CU Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 85 solder practices for SMD standard, fine pitch, and discrete components: version quantity PLCC 52, 68, 20 QFP 44, 84, 132, 184 sq. SOT23 3 x SOT89 2 x SOT143 1 x SOT233 1 x SO14 1 x SOM16 1 x SOL20 1 x Poti. 1 x DPAK 1 x Al. Kond. 6.30 mm 1 x Al. Kond. 4.00 mm 1 x Melf 2308 2 x Mini Melf 1206 6 x Tantal Chip Kond. A 1 Tantal Chip Kond. B 1 Tantal Chip Kond. C 1 Tantal Chip Kond. D 1 0402 Chip Kond. 10 x 0603 Chip Kond. 10 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 7 x 2220 Chip Kond. 1 x 1812 Chip Kond 2 x TSOP32 1 x 5020 Schwingquarz 1 x Also very suitable for machine assembly (Pick and Place) Size 100 x 140 mm

The TEC 20 form, fill and seal machine enables the production of bags made of polyethylene film from a flat film roll. The film can be neutral or coloured, with continuous printing or centred printing with print mark. The design of the machine and the low loading height allow ergonomic adaptation to a manual feeding station or easy connection to a feeding unit, such as an automatic counter, an automatic weighing system, an automatic assembly machine, an injection moulding machine, a conveyor belt or similar.