ROTH ELEKTRONIK GMBH

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 14 self-adhesive strips with quadro-pads Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 12 self-adhesive strips with rectangle pads in parallel order Pre-scratched rated break point for the separation of individual modules from the board Size 90 x 100 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 5 self-adhesive SM8-Adapters Pre-scratched rated break point for the separation of individual modules from the board Size 34.70 x 88.00 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 5 self-adhesive SM14-Adapters Pre-scratched rated break point for the separation of individual modules from the board Size 36.50 x 113.30 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 5 self-adhesive SM16-Adapters Pre-scratched rated break point for the separation of individual modules from the board Size 28.00 x 150.00 mm

Epoxy fibre-glass FR4 0.80 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) 10 self-adhesive SO8-Adapters Pre-scratched rated break point for the separation of individual modules from the board Size 19.00 x 67.25 mm