Aluminum Nitride Ceramic Structural Parts

The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in communication components, high power led, power electronic devices and other fields.Special spec products can be produced upon requests. Product Features： 1.Uniform microstructure 2.High thermal conductivity* (70-180 Wm-1K-1), tailored via processing conditions and additives 3.High electrical resistivity 4.Thermal expansion coefficient close to that of Silicon 5.Resistance to corrosion and erosion 6.Excellent thermal shock resistance 7.Chemically stable up to 980°C in H2 and CO2 atmospheres, and in air up to 1380°C (surface oxidation occurs around 780°C; the surface layer protects the bulk up to 1380°C).

Silicon nitride (Si3N4) is a high-melting-point material with high fracture toughness and excellent thermal shock resistance, It is considered to be one of the few monolithic ceramic materials that can withstand severe thermal shock and thermal gradient generated by hydrogen and oxygen rocket engines.

Pyrolytic boron nitride is a grade of hexagonal boron nitride. It is produced by the chemical vapor deposition process to create its solid body and all the boron nitride crystals grow parallel to the surface on which the vapor is deposited.

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.