Aluminum sputtering target

Aluminum thin film material
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Aluminum is used for PVD metallization in thin-film transistors for TFT-LCD for displays. Aluminum sputtering targets are highly pure and therefore ensure best conductivity of the material. The aluminum targets have a particularly fine-grained microstructure. This ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process. Material properties: Density [g/cm3]: > 2,70 Purity [%] > 99,999 (5N) Hardness [HV1]: 16 Thermal conductivity [W/(m·K)]: 238

  • Steels and metals - surface treatment and coating
  • aluminum
  • sputtering
  • PVD coating

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6600 Reutte - Austria